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Molybdenum Sputtering Targets: High-Performance Thin Film Deposition Solutions
Our high-purity Molybdenum Sputtering Targets are engineered for precision thin film deposition in advanced manufacturing and research applications. As a leading refractory metal specialist, we provide premium quality molybdenum targets that deliver exceptional performance, reliability, and consistency in various physical vapor deposition (PVD) processes.
Technical Specifications
Material Properties
| Property | Specification | Significance for Sputtering |
|---|---|---|
| Purity | 99.95% - 99.999% (3N5 - 5N) | Determines film purity and electrical properties |
| Density | ≥ 99.5% of theoretical density (10.22 g/cm³) | Affects target life, arcing behavior, and deposition rates |
| Grain Size | Fine-grained structure (typically 10-50 μm) | Promotes uniform erosion and consistent deposition rates |
| Crystallographic Orientation | Random or preferred orientation available | Influences film texture and properties |
| Surface Finish | Ra ≤ 0.8 μm (standard), finer finishes available | Critical for bonding to backing plates and minimizing particulate generation |
Standard Products
| Type | Form | Typical Dimensions | Purity | Bonding Options |
|---|---|---|---|---|
| Planar Targets | Circular, Rectangular | Up to 500mm diameter, thickness 3-12mm | 99.95% - 99.99% | Soldered, brazed, or clamped |
| Rotary Targets | Cylindrical | Length up to 4000mm, diameter 75-200mm | 99.95% - 99.99% | Mechanical clamping systems |
| Special Shapes | Custom geometries | According to chamber design | 99.95% - 99.99% | Custom bonding solutions |
Manufacturing Excellence
1. Material Processing
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High-Purity Powder: Starting material from certified suppliers with complete traceability
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Powder Metallurgy: Advanced pressing and sintering techniques for maximum density
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Thermo-Mechanical Processing: Hot forging, rolling, and annealing for optimal microstructure
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Precision Machining: CNC machining to exact specifications with minimal surface defects
2. Quality Control
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Chemical Analysis: GDMS, ICP-MS for trace element detection
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Metallographic Inspection: Grain structure, porosity, and inclusion assessment
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Ultrasonic Testing: Detection of internal defects and bonding integrity
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Surface Quality: White light interferometry for surface roughness measurement
Applications & Industries
Semiconductor & Microelectronics
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Interconnect Layers: Diffusion barriers and adhesion layers in IC manufacturing
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Gate Electrodes: Thin films for transistors and memory devices
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Solar Cells: Back contact layers in CIGS and thin-film photovoltaic cells
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Flat Panel Displays: Electrode layers in LCD, OLED, and touch panel production
Functional Coatings
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Tribological Coatings: Wear-resistant layers for cutting tools and mechanical components
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Optical Coatings: Reflective layers for mirrors and infrared applications
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Decorative Coatings: Durable metallic finishes for consumer products
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Protective Coatings: Corrosion-resistant barriers for harsh environments
Advanced Research
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Superconducting Films: For thin film superconductor research (MoN, MoC)
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Energy Research: Thin films for battery electrodes and fuel cell components
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Quantum Materials: Precursor layers for 2D materials like MoS₂
Performance Advantages
1. Superior Thin Film Quality
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Low Particulate Generation: Minimizes defects in sensitive semiconductor processes
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Excellent Film Uniformity: Consistent thickness across entire substrate
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High Deposition Rates: Efficient material utilization and throughput
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Stable Electrical Properties: Consistent resistivity and work function
2. Operational Efficiency
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Extended Target Life: Optimized microstructure reduces abnormal erosion
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Reduced Downtime: Reliable bonding minimizes target failure
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Process Stability: Consistent performance throughout target lifetime
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Versatility: Compatible with DC, RF, and pulsed DC sputtering
3. Technical Support
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Process Optimization: Assistance with parameter optimization for specific applications
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Failure Analysis: Expert support for troubleshooting deposition issues
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Custom Design: Engineering support for non-standard target configurations
Customization Capabilities
Material Options
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Standard Molybdenum: 99.95% purity for most industrial applications
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High-Purity Molybdenum: 99.99%+ for semiconductor and research applications
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Doped Molybdenum: Alloyed with specific elements for tailored film properties
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Recycled Targets: Environmentally responsible option using reclaimed molybdenum
Design Variations
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Bonding Configuration: Direct bond, solder bond, or mechanical clamping
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Backing Plate Integration: Copper, aluminum, or stainless steel backing plates
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Cooling Design: Optimized for high-power applications
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Shielding Integration: Custom shielding to minimize redeposition
Surface Treatments
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Polishing: Various surface finishes to meet specific process requirements
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Cleaning: Ultrasonic cleaning and vacuum packaging for critical applications
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Passivation: Surface treatments to minimize oxidation during storage
Quality Assurance & Certifications
Testing Protocols
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Full Traceability: Material certificates with complete production history
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Lot Consistency: Batch-to-batch consistency through strict process control
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Performance Validation: Pre-shipment testing for critical parameters
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Documentation: Comprehensive test reports with all specifications
Industry Compliance
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Semiconductor Standards: Meets SEMI specifications for critical applications
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RoHS/REACH: Compliant with environmental regulations
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ISO 9001: Manufactured under certified quality management systems
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Customer-Specific Requirements: Tailored testing and documentation packages
Ordering & Support
Lead Times
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Standard Products: 2-4 weeks
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Custom Designs: 4-8 weeks (depending on complexity)
