Semiconductor-Grade Molybdenum Substrate

Short Description:

High-Purity Molybdenum Substrates (99.95% Mo) - Precision-engineered wafers for power electronics and thin film deposition. Featuring ultra-low thermal expansion (4.8×10⁻⁶/°C), mirror-polished surfaces (Ra ≤0.8μm), and excellent thermal conductivity. Available in thicknesses 0.1-10mm with custom sizing. Ideal for GaN/SiC devices, LED heat sinks, and X-ray windows. ...

Material Grade: 99.95% Mo (Pure) | MoLa (Lanthanum Alloy) | TZM Alloy
Density: 10.2 g/cm³
Diameter: customizable
Application: Power Electronics & LED
Melting Point : 2620°C

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Product Details

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Semiconductor-Grade Molybdenum Substrate

Premium-grade molybdenum substrates engineered for demanding high-temperature and semiconductor applications. Our 99.95% pure Mo substrates deliver exceptional thermal management and dimensional stability.

Key Specifications

Parameter	Specification
Material	99.95% Pure Mo (TZM Alloy Optional)
Purity	≤50ppm metallic impurities
Thickness	0.1-10mm (±0.01mm tolerance)
Dimensions	Standard: 100×100mm to 500×500mm Custom: Up to 600×600mm
Surface Finish	Polished (Ra ≤0.8μm), Mirror (Ra ≤0.4μm)
Flatness	≤0.1mm/100mm

Core Advantages

✔ Thermal Stability - Withstands temperatures up to 1900°C (inert/vacuum)
✔ CTE Matching - Compatible with GaN, SiC, and other wide-bandgap semiconductors
✔ Superior Flatness - Minimizes thin film deposition defects
✔ Custom Processing - Laser cutting, drilling, and edge finishing available