High-Temperature Molybdenum Plate - Premium Quality for Industrial & Semiconductor Applications

High-Temperature Molybdenum Plate - Premium Quality for Industrial & Semiconductor Applications
  • High-Temperature Molybdenum Plate - Premium Quality for Industrial & Semiconductor Applications
  • High-Temperature Molybdenum Plate - Premium Quality for Industrial & Semiconductor Applications
  • High-Temperature Molybdenum Plate - Premium Quality for Industrial & Semiconductor Applications
  • High-Temperature Molybdenum Plate - Premium Quality for Industrial & Semiconductor Applications

Short Description:

High-Temperature Molybdenum Plates offer exceptional heat resistance (2623°C melting point) and high thermal conductivity, making them ideal for Semiconductor furnace components, Sputtering targets for thin film deposition, Aerospace rocket nozzles, Glass manufacturing electrodes, Nuclear and medical applications...


  • Material Grade: 99.95% Mo (Pure) | MoLa (Lanthanum Alloy) | TZM Alloy
  • Density: 10.2 g/cm³ (Pure Mo) | 9.8-10.1 g/cm³ (Alloys)
  • Thickness Range: 0.1mm - 50mm (Customizable)
  • Application: Semiconductor Furnace | Sputtering Targets | Rocket Nozzles | Glass Melting Electrodes
  • Melting point: 2,623°C (4,753°F)

Product Details

Product Tags

High-Temperature Molybdenum Plate - Premm Qiuuality for Industrial & Semiconductor Applications

Shaanxi Pioneer high-purity molybdenum plates (99.95% min) provide unmatched thermal and mechanical performance in demanding applications. Manufactured through precision rolling and annealing processes, these plates combine high melting point (2623°C/4753°F), excellent thermal conductivity, and exceptional corrosion resistance.


Core Advantages

✓ Extreme Heat Resistance - Withstands temperatures up to 2000°C in inert atmospheres
✓ Superior Thermal Conductivity - 138 W/m·K at 20°C (3× stainless steel)
✓ Low Thermal Expansion - Minimal deformation under thermal cycling
✓ Vacuum-Compatible - Low outgassing rates (<10⁻⁶ Torr)
✓ Custom Fabrication - Laser cutting, drilling, and edge profiling available


Technical Specifications

Grade

Mo1, Mo2, MoLa

Standard

ASTM B387

Density

9.8 - 10.2 g/cc

Surface

Polished,Cold-rolled, Sintered, Ground 


Applications

1. Semiconductor
• Heating elements for diffusion furnaces
• Wafer processing components

2. Aerospace & Defense
• Rocket nozzle liners
• Hypersonic vehicle thermal protection

3. Energy & Glass
• Sputtering targets for thin-film solar
• Electrodes for glass melting furnaces

4. Medical
• X-ray collimators
• Radiation shielding components





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